Low prices! Originals & Translations! Save your budget and time!
ONLINENORMS: Online Standards Store
Click View Shopping Cart
  1. Home
  2. STANDARDS AUSTRALIA - STANDARDS NEW ZEALAND
  3. AS/NZS 4329:1997 PDF

AS/NZS 4329:1997 PDF

AS/NZS 4329:1997 PDF

Name:
AS/NZS 4329:1997 PDF

Published Date:
03/05/1997

Status:
[ Withdrawn ]

Description:

Information technology - Telecommunications and information exchange between systems - Private integrated services network - Inter-exchange signalling protocol - Name identification supplementary services

Publisher:
Standards Australia / Standards New Zealand

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$21.582
Need Help?
Specifies the signalling protocol for the support of calling and connected name identification supplementary services at the Q reference point between private integrated services network exchanges connected together within a private integrated services network. The Q reference point is defined in AS/NZS 4136.1:1995. It is one of a series of Standards applicable to private integrated services networking. This Standard is identical with and has been reproduced from ISO/IEC 13868:1995.
Edition : 1st
File Size : 1 file , 130 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 24
Product Code(s) : 10150760, 10150755, 10150768
Published : 03/05/1997

History

AS/NZS 4329:1997
AS/NZS 4329:1997
Published Date: 03/05/1997
Information technology - Telecommunications and information exchange between systems - Private integrated services network - Inter-exchange signalling protocol - Name identification supplementary services
$21.582
AS/NZS 4329(INT):1995
AS/NZS 4329(INT):1995
Published Date: 01/01/1995
Information technology - Telecommunications and information exchange between systems - Private integrated services network - Inter-exchange signalling protocol - Name identification supplementary services - Stage 3

Related products

AS/NZS CISPR 16.1.4:2020
AS/NZS CISPR 16.1.4:2020
Published Date: 09/25/2020
Specification for radio disturbance and immunity measuring apparatus and methods, Part 1.4: Radio disturbance and immunity measuring apparatus - Antennas and test sites for radiated disturbance measurements (CISPR 16-1-4:2019 (ED 4.0) MOD)
$43.362
AS/NZS ISO/IEC 9126.2:2005
AS/NZS ISO/IEC 9126.2:2005
Published Date: 04/29/2005
Software engineering - Product quality, Part 2: External metrics
$43.362
AS/NZS 3580.9.14:2013
AS/NZS 3580.9.14:2013
Published Date: 04/26/2013
Methods for sampling and analysis of ambient air, Method 9.14: Determination of suspended particulate matter - PM2.5 high volume sampler with size selective inlet - Gravimetric method
$21.582

Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004
IEC/PAS 60027-6 Ed. 1.0 en:2004
Published Date: 09/20/2004
Letter symbols to be used in electrical technology - Control technology
$12.6
IEC/PAS 60050-732 Ed. 1.0 b:2007
IEC/PAS 60050-732 Ed. 1.0 b:2007
Published Date: 06/06/2007
International Electrotechnical Vocabulary - Part 732: Computer network technology
$61.2
IEC/PAS 60092-510 Ed. 1.0 en:2009
IEC/PAS 60092-510 Ed. 1.0 en:2009
Published Date: 04/29/2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
$89.7
IEC/PAS 60099-7 Ed. 1.0 en:2004
IEC/PAS 60099-7 Ed. 1.0 en:2004
Published Date: 04/27/2004
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
$95.1
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
$29.1
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
$32.1